Substrate thickness between 240 to 260gsm engraving should be 0.4 to 0.6mm.
Depending on the surface finish on the substrate, engraving depth of 0.7mm can be achieved.
The counterforce can be face routed to allow for the substrate to emboss deeper and stops the substrates constantly getting stuck in the die (trappage).
The surface finish of the substrate can determine depth, engraved and or etched angles, i.e. gloss, metallized, laminated etc.
With finished like gloss, metallized, laminated etc., we would recommend shallow engraving and embossing to avoid surface deformities such as cracks.
Engraving angles and depths may need to be modified based on the depth of emboss required against, type and thickness of the substrate being embossed.
The edges on the engraved image may need softer and or wider angles to avoid cracking the image edges on the substrate.
Creases on the edge of an embossed image can occur (Crows Feet is a common term used), this is because the embossing is too deep for the substrate.
Thin lines won’t emboss properly or at all, and in many cases, debossing may be a better option or a combination of embossing and debossing may be the best solution.
In some situations, increasing or even decreasing the pressure can solve some or all problems relating to a specific job.
Recycled paper and board can be very problematic in embossing, especially if the material is of poor quality. Inconsistences in the material can cause, breakage of counterforces, separation of substrate layers, and uneven wear of dies.
Metal, male and female die and counter may last longer but the extra cost and uneven wear may negate any benefits.
We recommend you create a folder with samples, processes, pressures and all relevant data so if you solve a certain type of problem the information is always at hand for you and or colleagues.
Guidance notes help but trial and error and, in the end, experience counts for everything.